Classification of electronic components - ASEMI Components Procurement | Original Factory Direct Classification of electronic components - ASEMI Suppliers | ICGOODFIND Classification of electronic components - ASEMI Wholesale_Classification of electronic components - ASEMI Electronic Components In-Stock Platform_ICGOODFIND

Model/Brand/Package

Category/Description

Inventory

Price

Data

Model: ZL50011QCG1

Brand: Microsemi

Encapsulation: LQFP-160

Category: interface chip

Description: Digital Time Switch, PQFP160, 24 X 24MM, 1.4MM HEIGHT, LEAD FREE, MS-026BGA, LQFP-160

2506

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Model: LE7942BDJC

Brand: Microsemi

Encapsulation: PLCC-32

Category: interface chip

Description: SLIC 1CH 63dB 120mA ±5V 28Pin PLCC

6509

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Model: MT3271BE1

Brand: Microsemi

Encapsulation: PDIP-8

Category: interface chip

Description: DTMF RX 4.19MHz 5V 8Pin PDIP Tube

5698

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Model: MT3371BN1

Brand: Microsemi

Encapsulation: SSOP-20

Category: interface chip

Description: DTMF RX 4.19MHz 5V 20Pin SSOP Tube

7893

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Model: MT3370BS1

Brand: Microsemi

Encapsulation: SOIC-18

Category: interface chip

Description: DTMF RX 4.19MHz 5V 18Pin SOIC Tube

8247

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Model: MT3370BSR1

Brand: Microsemi

Encapsulation: SOIC-18

Category: interface chip

Description: DTMF RX 4.19MHz 5V 18Pin SOIC T/R

7415

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Model: MT8816AP1

Brand: Microsemi

Encapsulation: PLCC-44

Category: interface chip

Description: MT8816 系列 13.2 V 45 Ohm 表面贴装 8 x 16 模拟开关阵列 - PLCC-44

1471

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Model: MT8809AE1

Brand: Microsemi

Encapsulation: DIP-28

Category: interface chip

Description: MT8809 系列 13.2 V 65 Ohm 8 x 8 模拟开关阵列 - PDIP-28

3454

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Model: MT88L70AS1

Brand: Microsemi

Encapsulation: SOIC-18

Category: interface chip

Description: MT66L70 系列 3 V 集成 DTMF 接收器 - SOIC-18

6751

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Model: MT8952BE1

Brand: Microsemi

Encapsulation: DIP-28

Category: interface chip

Description: HDLC Controller 28Pin PDIP Tube

7720

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Model: MT8816APR1

Brand: Microsemi

Encapsulation: PLCC-44

Category: interface chip

Description: MT8816 系列 13.2 V 8 x 16 表面贴装模拟开关阵列 - PLCC-44

5991

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Model: MT90866AG2

Brand: Microsemi

Encapsulation: BBGA-344

Category: interface chip

Description: Switch Fabric 2.375K x 2.375K/4K x 2.375K/2K x 2K 16.384Gbps 3.3V 384Pin BGA Tray

8711

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Model: MT9122AP1

Brand: Microsemi

Encapsulation: LCC-28

Category: interface chip

Description: Ic Echo Canceller Dual 28plcc

6159

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Model: MT9041BPR1

Brand: Microsemi

Encapsulation: LCC-28

Category: interface chip

Description: Ic Synchronizer T1/E1 28plcc

7158

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Model: MT9046ANR1

Brand: Microsemi

Encapsulation: BSSOP-48

Category: interface chip

Description: IC SYNCHRONIZER T1/E1 48SSOP

8156

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Model: MT9123APR1

Brand: Microsemi

Encapsulation: PLCC-28

Category: interface chip

Description: Ic Echo Canceller Dual 28plcc

7698

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Model: MT9171AP1

Brand: Microsemi

Encapsulation: PLCC-28

Category: interface chip

Description: Digital Subscriber Interface Circuit 28Pin PLCC Tube

7164

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Model: MT93L16AQ1

Brand: Microsemi

Encapsulation: BSOP-36

Category: interface chip

Description: IC ECHO CANCEL ACOUSTIC 36SSOP

3957

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Model: MT9075BPR1

Brand: Microsemi

Encapsulation: LCC-68

Category: interface chip

Description: Single Chip Transceiver 1TX 1RX 2.048Mbps 68Pin PLCC T/R

2905

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Model: MT8985APR1

Brand: Microsemi

Encapsulation: LCC-44

Category: interface chip

Description: Switch Fabric 256 x 256 16.384Mbps 5V 44Pin PLCC T/R

9018

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Model: MT9092AP1

Brand: Microsemi

Encapsulation: LCC-44

Category: interface chip

Description: Digital Telephone 44Pin PLCC Tube

4193

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Model: MT90869AG2

Brand: Microsemi

Encapsulation: BGA-272

Category: interface chip

Description: Switch Fabric 16K x 16K/8K x 8K 1.8V/3.3V 272Pin BGA Tray

2765

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Model: MT89L85AN1

Brand: Microsemi

Encapsulation: BSSOP-48

Category: interface chip

Description: Switch Fabric 256 x 256 16.384Mbps 3.3V 48Pin SSOP Tube

1386

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Model: LE79271MQCT

Brand: Microsemi

Encapsulation: QFN-28

Category: interface chip

Description: Telecom Interface ICs 1CH, NG SLIC, QFN28 4X5, TR, RoHS

3316

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Model: LE89900AMCT

Brand: Microsemi

Encapsulation: MSOP-10

Category: interface chip

Description: LE899 Series 1 FXO Low-Cost Surface Mount Line Driver or Receiver - MSOP-10

7368

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Model: ZL50058GAC

Brand: Microsemi

Encapsulation: BGA-252

Category: interface chip

Description: Switch Fabric 12K x 12K/8K x 8K/8K x 4K/4K x 8K/4K x 4K 1.8V/3.3V 256Pin BGA Tray

8609

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Model: ZL50016GAC

Brand: Microsemi

Encapsulation: BGA-256

Category: interface chip

Description: Switch Fabric 1K x 1K 1.8V/3.3V 256Pin BGA Tray

1130

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Model: ZL50075GAC

Brand: Microsemi

Encapsulation: BGA-324

Category: interface chip

Description: 数字总线开关 IC

6193

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Model: ZL50057GAG2

Brand: Microsemi

Encapsulation: BBGA-272

Category: interface chip

Description: Ic Digital Switch 12K Ch 272bga

6176

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Model: ZL50073GAG2

Brand: Microsemi

Encapsulation: BGA-484

Category: interface chip

Description: Switch Fabric 32K x 32K/16K x 16K 1.8V/3.3V 484Pin BGA Tray

1802

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